Gong Weibin: LED backlight and lighting device development trend

They all said that "there is heaven, there are Suzhou and Hangzhou." On July 19, 2010, the 2010 LED Illumination China Tour, sponsored by Gaogong LED and 12 regional industry associations, came to the second stop “Hangzhou”.

On the same day, the seminar was successfully held by Gaogong LED and Zhejiang Lighting Association, Hangzhou LED Industry Association and Ningbo Lighting Association in the conference hall on the 9th floor of Zhongbei Hotel, No. 500 Zhongshan North Road, Hangzhou. The meeting held a heated discussion on the hot topics of the current LED industry and the development of the LED industry in Zhejiang.

The conference attracted more than 150 spectators, including senior management and government agencies from LED companies in Zhejiang. At the meeting, Gaogong LED Zhang Xiaofei, Zhejiang Lighting Electrical Appliances Association Weng Maoyuan, Zhongjing Kechuang Zhongqun, Yuanfang Optoelectronics Pan Jiangen, Zhongke Wanbang He Wenming, Ruifeng Optoelectronics Gong Weibin, Philips Lumileds Zhou Xuejun, and Taxation China Li Wei gave a wonderful speech. .

Gong Weibin, General Manager of Shenzhen Ruifeng Optoelectronics Co., Ltd.

In the LED package, there are some bottlenecks in the field of lighting and backlighting. Gong Weibin, general manager of Ruifeng Optoelectronics pointed out that LED lighting has higher power and higher requirements for heat dissipation and light decay; while backlighting is mainly for consistency requirements. However, LED TV color rendering and reliability are the key points. Consumers choose LED TV mainly to be optimistic about its color performance. At the same time, for LED TV, one LED is broken, and the whole TV is darkened. This is a difficult for many domestic companies. He believes that the solution is mainly the improvement of light efficiency, the solution of heat dissipation, the way of phosphor distribution and the development of high reliability materials.

Gong Weibin, general manager of Shenzhen Ruifeng Optoelectronics Co., Ltd. said that the thinner the phosphor coating, the higher the efficiency obtained. From the packaging materials, it can be seen that the thermal resistance of the chip substrate material and the solid crystal material becomes the bottleneck of the thermal resistance of the high-power LED assembly. He also cited the advantages of eutectic flip-chip technology. He believes that the eutectic process will greatly improve the reliability of the high-power LED components due to the reduction of the overall thermal resistance for high-power LEDs. For a 40 mil chip, the thermal resistance can be controlled at 1 W/mk. By using a eutectic process and other packages, the overall thermal resistance can be controlled within 6 W/mk.

He said that in the domestic unsatisfactory equipment, the use of solder paste can only be said to be a temporary measure, and the supporting substrate materials also need to be selected. The advantage of flip chip technology is that it can improve the light extraction efficiency of the wafer and improve the heat dissipation path.

However, Gong Weibin finally stressed that LED backlight has the advantages of low power consumption, thinness and high color saturation. At present, LEDs still need a lot of improvement in TV applications, such as heat dissipation, metamerism, improvement of light efficiency, and choice of optical design and light guiding materials. The field of lighting and backlighting is the twin spindle of LED growth, LED technology. The upgrade will make its application field wider.

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